CMP Polishing Fluid
An effective grinding and polishing solution for sapphire, metal, and semiconductor materials.
产品展示
- 45%-50%
- 38%-42%
- 28%-32%
- 15%-24%
- ＜10%
- 研磨阶段
- 粗抛光
- 精抛光
- 酸性
- 中性
- 碱性
- 氧化硅
- 氧化铝
- 金刚石
- 蓝宝石
- 碳化硅
- 金属
- 陶瓷
Copyright © 2023 Shenzhen Jinwei Semiconductor Material Co., Ltd. All Rights Reserved. Guangdong ICP No.12001972
